Design Division Job Posting Archives

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From: Kristin Burns (kristin.burns@stanford.edu)
Date: 02/10/09


Platforms Engineering Intern (Hardware, Mechanical, Manufacturing) -
Google in Mtn View

The Platforms team is seeking individuals who have a desire to work
in our hardware, manufacturing, and mechanical engineering
groups. We are looking for interns in the following roles:

    * Product Data Management Process Intern
    * Electromechanical Quality Intern
    * Structural Analyst Engineering Intern
    * Mechanical Test Engineering Intern

IMPORTANT: If you are interested in applying, please send your
resume and unofficial transcripts to Daniel Rhee at
<mailto:drhee@google.com>drhee@google.com and Hanah Kim at
<mailto:hanah@google.com>hanah@google.com before February
15th. Please include the title of the internship position that you
wish to apply for in the subject of your email.

Product Data Management Process Intern

The Product Data Management Team at Google is looking for an intern
to assist with the upgrade of our current Product Data Management tool.

Responsibilities:
    * Assist in the development and implementation of process instructions
    * Perform overall configuration management activities (i.e. work
on BOM creation, BOM management)
    * Assist the PDM team in training system users
    * Potentially augment implementation team for PLM system upgrade effort
    * Participate in testing new PDM system
    * Work through duplicate P/N reconciliation and implementation of
preventative processes

Requirements:
    * Currently pursuing a BS industrial engineering or other
technical discipline
    * Experience in configuration management, Product Data Management a plus
    * Experience in process development
    * Excellent communication skills

Electromechanical Quality Intern

Quality intern will be responsible for root causing data center
equipment failures through analyzing failure data and hardware
diagnosis through sample collection. Products will be either
electrical or electromechanical products. Major portion of the time
will be spent analyzing data understanding correlation between failed
units and engineering characteristics.

Responsibilities:
    * Review and analyze failure symptoms for computer servers
through data collection
    * Query failure data in our database
    * Root cause simple part failures from the field using basic
equipment in electronics lab
    * Engage with suppliers in root causing failures
    * Create automated report generation from database
    * Communicate with suppliers, engineers and operations on a daily basis
    * Be able to diagnose why server components fail at a high level

Requirements:
    * Currently pursuing a MS or PhD in electrical engineering/mechatronics
    * Proficient in computer programming (SQL, Python, etc.)
    * Strong familiarity with SPC and knowledge of statistical tool is a plus
    * Previous experience in computer or related component
manufacturing or design is preferred
    * Understanding of process improvement, Six Sigma, FMEA concept
    * Strong communication and written skills

Structural Analyst Engineering Intern

Mechanical engineers are responsible for packaging and delivering our
infrastructure from the chip to the data center level in the most
cost effective and efficient manner possible. Structural Analysts
play a key role in design and evaluation of our system for operating
and shipping vibration/shock, not to mention evaluation for seismic
events. Each of these packages, infrastructures, etc. needs to be
validated and tested through thorough data collection and analyzed in
an engineering effort. With a BS in Mechanical Engineering and
working on your MS, or PhD level, you should have experience/course
work in structural design and analysis.

Responsibilities:
    * Work with Design Engineers to develop solutions, build up
prototype systems and validate performance by creating and following
engineering test plans.
    * Perform structural calculation for products seeing a host of
static and dynamic loads using spreadsheets, FEA program, MathCad, MatLab.
    * Design fixtures needed for product validation
    * Capture and Process results using accelerometers, dynamic
signal analyzers, shaker table, temperature chambers, thermocouples, etc.
    * Develop automated scripts for post-processing collected data
and collecting through data sources.
    * Data collection, analysis and reduction.
    * Debug of prototype systems.

Requirements:
    * Currently holding a BS, and pursuing a MS or PhD in mechanical
engineering
    * Class work or experience in shock and vibration analysis
    * Excellent problem solving abilities and great attention to detail
    * Proficient in a Computer Programming language (C++, Perl,
Python, Matlab etc.)
    * Additional consideration will be given to candidates with
experience inelectronics packaging, 3D mechanical design/analysis
experience (ProE/Mechanica), testing/verification using shaker
tables, shock machines, signal analyzers, accelerometers, thermocouples.

Mechanical Test Engineering Intern

Mechanical engineers are responsible for packaging and delivering our
infrastructure from the chip to the data center level in the most
cost effective and efficient manner possible. Testing is a key aspect
to these engineered design. Each of these packages, infrastructures,
etc. needs to be validated and tested through thorough data
collection and analyzed in an engineering effort. With a degree in
Mechanical Engineering at the BS, MS, or PhD level, you should have
experience/course work in mechatronics, heat transfer, fluid
mechanics, and structural design.

Responsibilities:
    * Build up prototype systems and validate performance by
following engineering test plans.
    * Develop automated scripts for post-processing collected data
and collecting through data sources.
    * Data collection, analysis and reduction.
    * Debug of prototype systems.
    * Create test fixtures to aid in prototype testing and data
collection efforts.

Requirements:
    * Currently pursuing a BS, MS or PhD in mechanical engineering
    * Excellent problem solving abilities and great attention to detail
    * Proficient in Computer Programming (C++, Java, Perl, Python, etc.)
    * Additional consideration will be given to candidates with
experience in electronics packaging including 3D mechanical design
experience (ProE), thermal and structural analysis and design
(Flotherm/Mechanica), and testing/verification including temperature,
pressure, flow rate, and velocity

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Potential applicants should communicate directly with the contact
listed in the posting. Please do not "reply" to the posting messages.

Job postings are archived at http://design.stanford.edu/archive/

Note: The job postings distribution list contains several
distribution lists: Design grad students, ME310 alumni, ME218
alumni, ME jobs list, etc. Members of multiple lists will receive
multiple copies of postings. Please excuse the duplication. Thank you.


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