job_072011b: GaAs HBT Fab Product Eng-110244, Avago Technologies (Fort Collins, CO)

From: Kristin Burns <kristin.burns_at_stanford.edu>
Date: Wed, 20 Jul 2011 13:56:35 -0700

What:
Career Opportunity

Where:
Avago Technologies (Fort Collins, CO)

Position Title:
GaAs HBT Fab Product Engineer-110244

Position Description:
The Avago Technologies Wireless Semiconductor
Division Fort Collins Wafer Fab develops and
manufactures GaAs HEMT, Silicon CMOS, Silicon
Bipolar, and Silicon MEMS devices in our pair of
wafer fabs on campus in Fort Collins, CO. We are
a world leader in RF wireless IC markets. The
Fort Collins Fab Engineering organization
supports process development and manufacturing
for all of the technologies listed above as well
as a recently released GaAs HBT technology. We
are a lean, fast moving, fast learning
organization that is constantly focused on
developing the next generation of process, device
and advanced packaging technologies. We work
closely with our circuit design colleagues
located in San Jose, CA, Seoul, Korea, and Penang, Malaysia.
In this position, you will be a member of a
world-wide team responsible for development and
manufacture of high-performance GaAs HBT devices
and process technologies for wireless
applications. The person in this role will work
closely with fellow team members to introduce new
GaAS HBT products and support their manufacturing
lifecycle. You will be working closely with IC
modeling, design and test personnel to create
practical solutions to tomorrow's wireless needs.
You'll be responsible for all phases of product
lifecycle support including MMIC test release,
parametric and yield optimization, as well as
response to fab-related customer quality issues.
Duties will also include interfacing with Avago's
internal and external partners/customers to
understand technical requirements and to provide
technical information. A strong understanding of
RF device technologies and the relationship of
device physical structure to RF performance
specifications are important to succeed in this
position. Specific duties include, but are not limited to:

Device Fabrication Analysis
- GaAs HBT device physics and wafer fabrication processes
- Knowledge of HBT device characterization, basic
transistor model operation and parametric extraction
RF/uWwave Circuit Analysis
- Circuit design and measurement techniques
- DC and RF test measurement and compensation for high current power amplifiers
- Power amplifier matching for Po, PAE, and minimum distortion
- Low noise matching for gamma opt, Rn, source
inductive matching, modeling MMIC and package
implementation using passives and bond wires, Cu pillar, flip chip processes
- Use of ADS (circuit simulation) and Cadence (MMIC layout)
- S-parameter measurement, usage, and design as
well as understanding of bias and temperature effects
Database Analysis
- Ability to evaluate DC/RF distributions &
select specs/guardbands to optimize yield
- Knowledge of reliability testing and device failure mechanisms
- Ability to analyze product failures to arrive
at root cause and corrective action
- Ability to work with product document management systems
Qualifications

Required Skills/Experience:
- Bachelor's degree in EE, physics or related field
- 3-5 years relevant industry experience
- Experience with GaAs HBT integrated circuit manufacturing processes
- Strong communication and teamwork skills,
ability to work with multi-discipline, cross-cultural teams
- Ability to interact within a global
manufacturing supply chain including SE Asia backend operations
- Motivated self-starter, works independently & with initiative
- Must have legal authorization to work in the US
Preferred:
- Master's or PhD degree in EE, physics or related field
- 5-8 years relevant industry experience
- HBT MMIC test development
- Familiarity with wireless RF markets
- Proficiency with tools for device and circuit simulation
- Experience in GaAs HBT device modeling, design and fabrication

Company Overview:
· Avago Technologies is a leading supplier
of analog interface components for
communications, industrial and consumer applications.
· By leveraging its core competencies in
III-V compound and silicon semiconductor design
and processing, the company provides an extensive
range of analog, mixed signal and optoelectronics
components and subsystems to more than 40,000 customers.
· Backed by strong customer service
support, the company's products serve four
diverse end markets: industrial and automotive,
wired infrastructure, wireless communications, and computer peripherals.
· Avago has a global employee presence and
heritage of technical innovation dating back 50
years to its Hewlett-Packard roots. Information
about Avago is available online at <http://www.avagotech.com>www.avagotech.com.

Recent News:
· Avago is preparing to invest
significantly in on-shore semiconductor manufacturing.
· The company has recently announced
plans to invest nearly 75 million dollars to
retrofit an existing manufacturing facility in Fort Collins, Colorado.
· Avago’s continued investment in U.S
based semiconductor manufacturing is clearly a
strategic move that will strengthen the company’s global supply chain.
· This FAB expansion is expected to
create about 100 high-tech jobs in the area
around Fort Collins, Colorado and the company is
beginning to actively hire those engineers and technologists right now.

For a comprehensive list of opportunities, please visit:
<http://www.avagotech.com/pages/corporate/careers/>http://www.avagotech.com/pages/corporate/careers/

Or, to express interest in regard to this particular position, please contact:

Shane Johnson
Avago Technologies
Global Talent Acquisition Team
Senior Recruitment Consultant
<mailto:shane.johnson_at_avagotech.com>shane.johnson_at_avagotech.com




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Received on 2011-07-20 13:56:27

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